IC Packaging Specialists
Call: +1 (800) 218-1573
Models and Measurement
PSS performs many types of thermal measurements in our clean, ESD protected laboratory. We can perform thermal characterization from the chip to the system level with multiple tools to insure accuracy and meaningful results with characterization techniques that have been tested and proven over 20 years of experience in the field. The goal is to provide fast, reliable analysis that will help our customers to approach new designs as well as solve existing thermal challenges. An extensive array of measurement capabilities is complemented with computer modeling and simulation to find a solution that has the best performance, reliability and cost for the application. Standardized tests are offered for JEDEC compliance as well as custom configured apparatus for specialized needs. Finite-element and computational fluid-dynamics modeling are available for developing accurate behavioral attributes for product design and problem assessment and solution.
Modeling and Simulation
Thermal Modeling and simulation tools include FEA and CFD solvers, mechanical design programs and thermo-mechanical analysis. 2D and 3D designs can be assembled and tested virtually for thermal and mechanical behavior. Motion simulation tools are available to analyze moving parts. CFD modeling supports design and development requirements for existing and new designs for packages, PCB, heat sinks and chassis. Tools include SolidWorks, COSMOS, FloTherm, FlowWorks, Ansys and others.
Extensive measurement capability is found in the thermal lab. Measurement of all aspects of chip, package, PCB, components and systems is available. TIM, heat sinks, temperature profiles, model validation, live device testing, thermal test chips and more.... PSS has the experience and tools to support your needs.
Instrumentation and Fixturing
Environments include cold/hot plate, still-air, low speed wind tunnel, custom fixtures and enclosures
Test capability: Semiconductor thermal test systems for live (production) devices as well as prototypes and thermal test chip. Power levels to 1KW, automation and discrete instrumentation available. Thermal conductivity measurements for TIM and other materials. Non-contact measurement by IR or thermo-reflectance, controlled temperature chambers and more.
Support technology such as thermal load boards, thermal test chips and physical simulation components.
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