IC Packaging Specialists
Cascade Microtech HF Probes
Call: +1 (800) 218-1573
Models and Measurement
PSS has the tools and knowledge to support package, socket, PCB, backplane, connector and cable electromagnetic characterization. Models, measurements and simulation are supported.
Modeling and Simulation
Electromagnetic modeling of interconnects is important for all designs that may include high speed signaling technologies such as LVDS, CML or ECL. Designing high-speed systems requires a thorough knowledge of interconnect impedance, discontinuities, termination schemes, coupling, socket or connector effects and off-board structures such as backplanes and cabling. HDMI, PCIe, SerDes and SATA are currently popular for multi-gigabit data transmission needs. Using full-wave modeling tools, the electrical behavior of physical structures is extracted and used to create frequency dependent circuit models for use in simulation engines. Fast 2D and 3D tools are also available for initial layout and routing design rule generation or problem solving for already-designed systems. Solution methods include FEA, MoM, FDTD and FD planar. Tools available include Ansoft HFSS, Agilent ADS, e-Systems Sphinx Signoff, AiTec ADK, iConnect, WinCal and others. Output can range from raw data to Touchstone, s-parameter, circuit model, and simulation results to complete circuit analysis and simulation, parametric analysis and optimization.
Validating models and simulation is a key part of the design and analysis process. Models can capture the essential behavior of the system but are limited to near ideal boundary conditions and geometry aspect ratios. For comparison and analysis, measurement techniques must present accurate, repeatable response from the device under test. PSS engineering has been performing high-frequency measurements of package and PCB interconnects for over 15 years. Participation in industry groups such as IEEE, EIA and JEDEC has enabled us to identify, develop and utilize proven measurement methods using time and frequency domain instrumentation and fixturing. PSS uses VNA and TDR/TDT techniques to extract circuit models and behavioral simulations. Instruments are calibrated and maintained to insure accurate results. High quality cabling, connectors, terminations and calibration standards are used in all operations. Signal injection/response measurement ranges from SMA or other high frequency connectors to fixed and variable pitch microwave-style single ended and differential probes. A precision probe station and micron-resolution manipulators are used to accurately position the probes.
Instrumentation and Fixturing
See our complete list of electrical characterization instrumentation here.
© 2010 Package Science Services LLC