top of page
PACKAGE SCIENCE SERVICES
IC PACKAGING EXPERTS SiP DESIGN SPECIALISTS
Some people dream of success. We make it happen.
SERVICES
SYSTEM IN PACKAGE EXPERTS
Thermal Modeling: Heat Flux
Thermal Modeling: Heat Flux Result FEM
SYSTEM IN PACKAGE EXPERTS
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
CORE EXPERTISE
IC PACKAGING - SiP, IoT PACKAGING EXPERTS
PSS Mission
Provide best-in-class engineering services from concept through mass production using state-of-the-art tools and techniques in modeling, simulation, measurement and analysis for the design, development and manufacturing of integrated circuit packaging and related technologies
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
-
IC PACKAGE DESIGN
-
THERMAL MODELING FEM/CFD
-
THERMAL ANALYSIS / DESIGN
-
THERMAL MEASUREMENTS
-
ELECTROMAGNETIC MODELING / ANALYSIS
-
MECHANICAL DESIGN
-
MECHANICAL MODELING / FEM
- 3D PRINT AND CNC SUPPORT / DESIGN
- PROCESS / MATERIALS SUPPORT
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
bottom of page